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| 1/4 Structure Product Name Type Features Silicon Monolithic Integrated Circuit Step-up DC/DC converter for medium size LCD panel BD6150MUV High efficiency PWM step-up DC/DC converter (fsw=1.25MHz) High accuracy and good matching current driver 6ch (MAX 30mA/ch) Drive up to 10 in series x 6 strings in parallel =60 white LEDs Absolute Maximum Ratings (Ta=25C) Parameter Symbol Maximum applied voltage 1 Maximum applied voltage 2 Maximum applied voltage 3 Maximum applied voltage 4 Power dissipation 1 Power dissipation 2 Power dissipation 3 Operating temperature range Storage temperature range Rating 7 25 30.5 41 500 780 1510 -40 ~ +85 -55 ~ +150 Unit V V V V mW mW mW C C VMAX1 VMAX2 VMAX3 VMAX4 Pd1 Pd2 Pd3 Topr Tstg Condition VREG, ISET, PWMDRV, FSEL, OCPSET, VDET, TEST LED1, LED2, LED3 LED4, LED5, LED6 VBAT, FAILFLAG, PWMPOW SW *1 *2 *3 - *1 Reduced 4.0mW/C With Ta>25C when not mounted on a heat radiation Board. *2 1 layer (ROHM Standard board) has been mounted. Copper foil area 0mm2, When it's used by more than Ta=25C, it's reduced by 6.2mW/C. *3 4 layer (JEDEC Compliant board) has been mounted. Copper foil area 1layer 6.28mm2, Copper foil area 2~4layers 5655.04mm2, When it's used by more than Ta=25C, it's reduced by 12.1mW/C. Operating conditions (Ta=-40 to +85C) Parameter Supply voltage Symbol VBAT Min. 4.2 Rating Typ 12.0 Max 26.0 Unit V Condition This product isn't designed to protect itself against radioactive rays. REV. A 2/4 Electrical Characteristics (Unless otherwise noted, VBAT=12V, Ta = +25C) Parameter Quiescent current Current consumption [PWMPOW Terminal] Low input voltage range1 High input voltage range1 Pull down resistor1 [PWMDRV Terminal] Low input voltage range2 High input voltage range2 Pull down resistor2 [FSEL Terminal] Low input voltage range3 High input voltage range3 Pull down resistor3 [FAILFLAG] Input resistor Off current [Regulator] VREG voltage Under voltage lock out [Switching Regulator] LED control voltage Switching frequency Duty cycle limit SW Nch FET RON [Protection] Over current limit OCPSET open protect Over voltage limit Input SBD open protect VDET leak current [Current driver] LED maximum current LED current accuracy LED current matching LED current limiter LED terminal Over voltage protect ISET voltage Symbol Iq Idd POWL POWH POWR PDRVL PDRVH DRVR FSL FSH FSR FFIR FFIST VREG UVLO VLED fsw Duty RON Ocp OOP Ovl Sop OVIL ILMAX ILACCU ILMAT ILOCP LEDOVP Iset Min. 0 2.1 100 0 2.1 100 0 2.1 100 1.0 4.2 3.3 0.56 1.00 91.0 1.4 0.96 0.02 10.0 0.5 Limits Typ. 1.6 3.6 300 300 300 2.0 0.1 5.0 3.7 0.70 1.25 95.0 0.48 2.0 0.0 1.00 0.05 0.1 0 11.5 0.6 Max. 4.4 5.4 0.9 VBAT 500 0.9 6.0 500 0.9 6.0 500 3.0 2.0 6.0 4.1 0.84 1.50 99.0 0.58 2.6 0.1 1.04 0.08 1.0 30 3.0 1.5 0.1 13.0 0.7 Unit A mA V V k V V k V V k k A V V V MHz % A A V V A mA % % mA V V Condition PWMPOW=PWMDRV=0V VDET=0V,ISET=22k PWMPOW=2.5V PWMDRV=2.5V FSEL=2.5V FAILFLAG=2.5V PWMPOW=0V No load VBAT falling edge FSEL=L (GND short) LED1-6=0.3V ISW=80mA OCPSET=68k OCPSET=2M Detect voltage of VDET pin Detect voltage of VDET pin *1 ILED=16~20mA Each LED current/Average (LED1-6) ILED=16~20mA Current limit value at ISET resistor 1k setting PWMDRV=2.5V *1 This parameter is tested with dc measurement. REV. A 3/4 Package outline drawing Type D6150 LOT No. VQFN024V4040 ( Unit : mm ) Terminals PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 PIN Name SW SW N.C. PGND FAILFLAG OCPSET VDET TEST FSEL ISET GND N.C. LED1 LED2 LED3 LED4 LED5 LED6 N.C. GND PWMDRV VREG PWMPOW VBAT Block diagram VBAT VREG FAILFLAG SBD OPEN/ Output short PROTECT VDET REG TSD PWMPOW UVLO Internal Reset Output Over Voltage PROTECT Clamp Internal Power Supply FAULT DETECTOR LED TERMINAL OPEN/SHORT DETECTOR ERRAMP PWM COMP LED1 + SW SW Internal Power Control Soft start Control SENCE LED RETURN LED2 LED3 LED4 LED5 LED6 OSC Current SENCE Over Current Protect + SELECT 6ch PGND + - ISET Resistor driver Current Driver N.C. OCPSET TEST FSEL GND PWMDRV ISET GND REV. A 4/4 (1) Absolute Maximum Ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety measures including the use of fuses, etc. (2) Operating conditions These conditions represent a range within which characteristics can be provided approximately as expected. The electrical characteristics are guaranteed under the conditions of each parameter. (3) Reverse connection of power supply connector The reverse connection of power supply connector can break down ICs. Take protective measures against the breakdown due to the reverse connection, such as mounting an external diode between the power supply and the IC's power supply terminal. (4) Power supply line Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. In this regard, for the digital block power supply and the analog block power supply, even though these power supplies has the same level of potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressing the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns. For the GND line, give consideration to design the patterns in a similar manner. Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant. (5) GND voltage Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state. Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric transient. (6) Short circuit between terminals and erroneous mounting In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply or the GND terminal, the ICs can break down. (7) Operation in strong electromagnetic field Be noted that using ICs in the strong electromagnetic field can malfunction them. (8) Inspection with set PCB On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress. Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the jig. After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention to the transportation and the storage of the set PCB. (9) Input terminals In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics. (10) Ground wiring pattern If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well. (11) External capacitor In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc. (12) Thermal shutdown circuit (TSD) When junction temperatures become 175C (typ) or higher, the thermal shutdown circuit operates and turns a switch OFF. The thermal shutdown circuit, which is aimed at isolating the LSI from thermal runaway as much as possible, is not aimed at the protection or guarantee of the LSI. Therefore, do not continuously use the LSI with this circuit operating or use the LSI assuming its operation. (13) Thermal design Perform thermal design in which there are adequate margins by taking into account the permissible dissipation (Pd) in actual states of use. (14) Selection of coil Select the low DCR inductors to decrease power loss for DC/DC converter. Cautions on use REV. A Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law. Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact us. ROHM Customer Support System http://www.rohm.com/contact/ www.rohm.com (c) 2009 ROHM Co., Ltd. All rights reserved. R0039A |
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